A Global Fabless Semiconductor Group Offering Connectivity IPs and Chiplet Design Turnkey Services
Egis Breaking News
Egis Technology Partners with ASICLAND to Accelerate Global AI HPC Server Chip Deployment
[November 5, 2024, Taipei] Egis Technology has signed a strategic partnership agreement with South Korean chip design company, ASICLAND Co., Ltd., to co-develop AI HPC Server Chiplet designs. This collaboration encompasses multiple key technologies, including CPU Die, AI Die, IO Die, IP licensing (such as UCIe, LPDDR5, PCIE5/6), and advanced CoWoS packaging development, all aimed at the high-end data center market.
────Egis Technology Inc., 2024.11.05
────Egis Technology Inc., 2024.11.05
InPsytech, Inc. (Egis Group) Successfully Verifies ONFI PHY IP at 4,800 MT/s to Drive High-Speed Storage Applications
[Taiwan, October 25, 2024] — InPsytech, Inc., a leading high-speed interface IP company, announced today that its ONFI 4,800 MT/s IP, designed according to the JESD 230G standard, has successfully passed silicon validation on N6/N7 nodes. This comprehensive ONFI IP solution includes complete IO, PHY, and PLL designs, marking a significant milestone in the high-speed storage application domain for InPsytech.
────Egis Technology Inc. 2024.10.25
────Egis Technology Inc. 2024.10.25